High precision optical system for advanced semiconductor patterning
Optical lithography systems project circuit patterns onto semiconductor wafers with nanometer precision, defining the critical device features that enable advanced computing, AI and high‑density electronics.
Technologies:
- MEMS handling
- Wafer back-end services including wafer testing
- SMT, flip-chip, underfill and glob-top
- Complex mechanical assembly with final module qualification
BENEFITS
- Early co‑development partnership enabling efficient industrialization, optimized supply chains, and scalable production
- Flexible integration levels from sub‑assemblies to fully qualified modules
- Extensive expertise in precision flip‑chip MEMS assembly under stringent cleanliness requirements
- High‑density miniaturization capability for complex, highly accurate assemblies
CORE STRENGTHS
- Broad in‑house assembly capabilities spanning the industry’s widest range of technologies
- Proven track record with blue‑chip customers built over more than 15 years of continuous partnership
- High‑stability opto‑mechanical alignment ensuring consistent pattern accuracy
- Reliable system‑level integration of complex optics supporting precise, repeatable performance