High performance interconnect process for multi‑die chiplet packaging
Chiplet architectures have moved from concept to cornerstone. Modern multi‑die systems are now deployed at scale, delivering the compute density, modularity, and power efficiency required by AI, cloud infrastructure and next generation heterogeneous computing platforms.
Technologies:
- Wafer back-end services including wafer testing
- Under-bump metallization (UBM)
- Solder ball attach and flip-chip with underfill
- Automated module testing
BENEFITS
- Heterogeneous Integration enabling the combination of silicon components built on different process nodes
- Manufacturing benefits including increased yield and enhanced design flexibility
- Improved thermal and power distribution consistency supporting stable operation
- Modular design including individual chiplet (processors, memory, I/O) designed, manufactured and tested
CORE STRENGTHS
- Robust multi‑die assembly control ensuring stable performance across tightly packed chiplets
- High‑accuracy die placement and interconnect alignment supporting fine‑pitch architectures
- Reliable scaling from early builds to volume production with consistent process stability and repeatability
- Predictable interconnect performance across complex die layouts enabling reliable operation