Come meet us in Grenoble! 

We’re proud to be part of imaps MINAPAD in Grenoble, taking place on June 3-4 and to showcase our longstanding expertise in miniaturization. 
Where: Congress Center Grenoble. 

Visit our booth #11 to meet our colleagues Ludovic GODIN and Matthias Lorenz, who are ready to discuss your challenges and explore solutions in design, development and manufacturing of microsystems and micro and optoelectronics.

Don’t miss the presentation by Marc Dreissigacker, who will provide valuable insights into Fan-Out Wafer Level Packaging (FOWLP) offered by AEMtec —highlighting its core strengths and benefits. AEMtec is among the few providers of this advanced technology in Europe.

We look forward to connecting with you!