AEMtec GmbH follows the successful growth course of the past years. In calendar week 28, began the first construction work on the AEMtec site in Berlin, Germany.
With the investment in a new film thickness gauge, AEMtec expands their Wafer Back-end Services offering. This new instrument, which employs a polycapillary optic, now enables precise analysis of…
Following the successful extension of the wafer back-end portfolio by Under Bump Metallization (UBM) and Solder Balling, AEMtec enlarges now the wafer dicing segment.
If you are looking for expert help with wafer treatment, preparation and packaging, offering advice on product and process development as well as volume production - all from a one-stop-shop, then…