AEMtec provides a broad portfolio of high-end chip-level technologies, naturally in clean room (ISO 5, ISO 7 and ISO 8) environments.
- Chip and wire bonding
- Flip chip
- Maximum placement accuracy
- Opto packaging
- Wafer back-end services
All common substrates such as standard circuit boards (rigid, rigid-flex), foil, ceramics, silicon wafers, glass or IMS are processed.
Multi-chip modules (MCMs) enable the implementation of complete functions and partial circuits as a system in a package (SIP). Modularisation concepts are supported and help to cut manufacturing costs. AEMtec creates highly integrated components with many I/Os in compact modules as a cost-saving and efficient solution.
Visit the Download page to view the AEMtec certifications.