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All components are subjected to certain tests (standards, customer-specific) as part of the qualification process to ensure the quality and reliability of the microsystems we develop.  

This process optimises the production yield and reduces the costs of production and quality assurance.


  • Burn-in tests
  • Lifetime tests
  • Temperature change tests (TCT)
  • Temperature and humidity testing
  • High-temperature storage (HTS)
  • High-temperature operating life (HTOL)
  • Vibration and acceleration
  • Fall tests

Tests and Analysis

Individual products - individual tests

An in-house engineering team is available and develops product-specific test and analysis procedures, tailored to the specification of the individual products.

The in-house test engineering team starts to develop the corresponding tests, even during the development phase of the requested product. Qualified and reliable.

Series tests
  • Automatic optical inspection
  • Function test
  • Boundary scan test
  • In-circuit test (ICT)
  • Flying probe test
  • Dimensional control
  • Optical measurement of the placement accuracy
  • Reliable products from the start
  • Unbeatable quality and sustainability
  • Individuality for each product
  • Cost savings in the areas of production and quality
  • Optimisation of manufacturing yield


Cuts Cross-sectional analysis
2D X-Ray examination X-Ray
Electron microscopy SEM, EDX
Acoustic microscopy C-SAM
Temperature change test  
Temperature-humidity test  
High-temperature storage