What is Wafer Dicing? 

Wafer dicing is a critical semiconductor manufacturing step in which a processed wafer is separated into individual chips (dies). Using highly precise cutting technologies, the…

High-precision placement is the process of positioning components with extreme accuracy during assembly. In photonics, semiconductor packaging, and microelectronics, even the smallest deviation can…

As specialists in miniaturization, we support you right from the very beginning of your project.

From concept to realization, we are your trusted partner:

• We listen carefully to your ideas and…

Join us! 

We’re thrilled to be back at the EVERTIQ Expo in Berlin — this time in Berlin – Siemensstadt. 
It’s always a highlight to reconnect with our valued partners and meet forward-thinking…

Come meet us in Grenoble! 

We’re proud to be part of imaps MINAPAD in Grenoble, taking place on June 3-4 and to showcase our longstanding expertise in miniaturization. 
Where: Congress Center…

Auch dieses Jahr öffnen wir wieder die Türen für interessierte Schülerinnen und bieten einen spannenden Einblick in den Beruf Mikrotechnologe (m/w/d). 

Technik ist nur was für Jungs? Ganz und gar…

Join Daniel Lieske, Senior Expert Advanced Packaging from AEMtec, as he presents proven solutions in miniaturization and advanced packaging. 

Hear how innovative processes and cutting‑edge equipment…

…to connect with our technology experts at booth #526 in the German Pavilion from 17 – 19 March in Los Angeles. 

We are excited to join this informative and dynamic event.
Visitors can expect a…

Our Team is heading to the MD&M trade show in Anaheim, showcasing cutting‑edge optoelectronic solutions for MedTech and BioTech applications. 

Within micro-technology and optics. 
AEMtec is a…

Booth #4205-47 (German Pavilion)

Finals steps completed. Samples are shipped and ready to showcase newest findings and reliable solutions in the field of miniaturization.

We are looking forward to meet…