System integration in electronics - challenges and strategies for future packaging technologies
Future technologies such as artificial intelligence, quantum technology or high-performance computing are the basis for solving challenges for society as a whole such as digitalization, the energy transition or environmental issues. At last, this is only possible through advanced or novel system integration strategies in microelectronics and microsystems technology.
Chiplet technology – Challenges and Opportunities
Optimized performance and integration of various technologies leads to greater efficiency in semiconductor solutions. Chiplet technology is a new design strategy in which, instead of a complex system-on-chip (SoC), several semiconductors (“chiplets”) are connected to each other using very short and dense wiring.
