Optimized performance and integration of various technologies leads to greater efficiency in semiconductor solutions
Chiplet technology is a new design strategy in which, instead of a complex system-on-chip (SoC), several semiconductors (“chiplets”) are connected to each other using very short and dense wiring. It is changing semiconductor design by dividing systems into specialized components, optimizing performance and integrating different technologies. The modular approach (“Lego principle”) ensures scalability, facilitates easy upgrades and accelerates time to market and increases the longevity of semiconductor solutions. Chiplet technology also improves yield and cost efficiency by reducing the impact of errors across the entire system. In the fast-moving technology landscape, chiplet innovation is considered a cornerstone for efficient, scalable and future-proof computing solutions and is therefore a crucial element for technical progress.
In addition to the various design possibilities, chiplet technology requires high-precision flip-chip assembly on high-density wiring carriers. The contact pitches proposed by the UCIe consortium range from 150 µm currently to 25 µm in the coming years. This requires substrates with corresponding fine conductor tracks. From the current 10-20 µm conductor width in SAP technology (semi-additive processing), the roadmap goes to 2 µm structures and below.
Currently, substrates with a conductor track width of 2 µm and smaller can only be manufactured as so-called silicon interposers. Si wafers are provided with through holes (TSVs) and a wiring layer RDL is created on both sides. This leads to high costs, difficult availability and problems with assembly on the system circuit board. Current investigations are aimed at using glass with through holes (TGVs) as a substrate core on which dielectric layers are laminated on both sides. The new design strategy reduces costs and significantly increases efficiency.
AEMtec and Fraunhofer IZM look back on many years of successful cooperation in various projects and want to continue this in the area of chiplet technology. Based on IZM's technical capabilities for the production of organic substrates with currently 5 -10 µm lines / space structure resolution, the goal of the collaboration will be process development through to industrialization for customers, including technology transfer, in order to realize high-pole chiplet structures.
We look forward to further collaboration and to jointly and innovatively developing future-oriented solutions in the semiconductor sector.