Fan-Out Wafer-Level Packaging (FOWLP) is an advanced semiconductor packaging technology that enables higher performance, greater integration density, and reduced form factor compared to traditional packaging methods. It plays a critical role in the miniaturization and functionality of modern electronic devices.
Unlike Fan-In Wafer-Level Packaging (WLP), where interconnects are confined within the original footprint of the die, FOWLP "fans out" the connections beyond the die area. This is achieved by embedding the die in a reconstituted wafer using a molding compound, allowing more space for additional redistribution layers (RDLs). These RDLs facilitate external connections, enabling the integration of multiple components (such as analog and digital dies) within a single package.
FOWLP is a solution for miniaturized packages with excellent RF and thermal performance
ADVANTAGES
- Higher RF performance, due to shortest interconnect lengths
- Package miniaturization, high integration density
- SMT solderable package, compatible with conventional technologies
- Substrate-less package, routing on package surface via thin-film RDL
- Heterogeneous Integration
- Cost efficiency through wafer-level processing
Despite these benefits, small and medium production volumes of FOWLP remain largely inaccessible in Europe due to high entry costs and limited availability. AEMtec fills this critical gap by offering flexible, cost-effective FOWLP solutions tailored specifically for low- to mid-volume production needs.