COMPLEX MICRO - AND OPTOELECTRONICS
As an established B2B company for complex and reliable solutions in the field of miniaturization, AEMtec offers a broad technology portfolio including wafer back-end services, chip on board, flip chip, 3D integration and opto packaging.
Customer-specific requirements from the medical, industrial and automation, data and telecommunications, semiconductor and aerospace sectors are reliably implemented soon.
The range of services includes design, development, industrialization, qualification, prototyping (NPI), test and test system development, series production, supply chain management and after sales services