COMPLEX MICRO - AND OPTOELECTRONICS
As an established B2B company for complex and reliable solutions in the field of miniaturization, AEMtec offers a broad technology portfolio including wafer back-end services, chip on board, flip chip, 3D integration and opto packaging.
Customer-specific requirements from the medical, industrial and automation, data and telecommunications, semiconductor and aerospace sectors are reliably implemented soon.
The range of services includes design, development, industrialization, qualification, prototyping (NPI), test and test system development, series production, supply chain management and after sales services
Finally, we present our third Interview from our Interview series between Julia Hohenstein and Dr.Andreas Ostmann concerning the Chemical Bumping process. Learn more about the idea, initial hurdles and the consequent sticking to the plan.
We are pleased to present the second interview between Ingolf Schlosser and Dr. Tanja Braun. Learn more about fan-out technology. It stays exciting.
Learn interesting insights into the work with our partners and outlooks about the future in the field of microtechnology in our new video interview series. The first interview between Daniel Lieske and Dr. Michael Töpper about "Redistribution Layers" is already online. We look forward to you taking the time to sit back and listen to our experts.