Precision aligned photonic link for high‑speed intra‑satellite data transfer
Intra‑satellite optical interconnect modules provide high‑speed internal data links using photonic transmission rather than electrical cabling, enabling low‑latency communication between onboard processors, memory, and sensor subsystems in next‑generation spacecraft.
Technologies:
- Opto-electronics module design and co-development
- Advanced packing including flip-chip, chip-on-board (COB), 2.5D/3D, system-in-package
- Active and passive optical alignment
- Cleanroom manufacturing (ISO 5-8)
BENEFITS
- Robust new production introduction (NPI) process
- Pre-series and Series production continuity
- Selection of space‑compatible materials and processes for mission‑critical reliability
- Full traceability and long‑term lifecycle support for regulated and high‑reliability applications
CORE STRENGTHS
- Strategic bridge between optical components and satellite payload primes
- Integration between optical building blocks into space qualified opto-electronic modules
- Stable optical performance under actual conditions ensuring dependable data links throughout the mission
- Precise coupling of photonic components supporting low‑loss, high‑speed communication