In just four weeks, the doors of electronica 2026 will open, bringing together the electronics industry's innovators and decision-makers. Our team will be on site to discuss the latest findings, new technological developments, and challenging applications in the field of miniaturization. One topic we are particularly passionate about is Fan-Out Wafer-Level Packaging (FOWLP). Despite its significant technical advantages, FOWLP remains largely inaccessible in Europe for small and medium-volume projects.

We are helping to close that gap.

Visit our booth to learn how accessible, high-quality FOWLP solutions can support your next generation of products. Let's connect at electronica 2026.