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Established more than 20 years ago as a spin-off from an international technology group, AEMtec GmbH focused initially on the field of unpackaged semiconductors and exclusively supplied the data and telecommunications market.

Over the last two decades, AEMtec has extensively expanded its technology portfolio, evolving into its current position as market leader in the high mix/low volume market for opto-electronic components, with annual sales of around 70 million Euro.

AEMtec caters to global, customized requirements in the fields of medical technology, industry and automation, data and telecommunications, semiconductors and aerospace.

History

AEMtec implements Electroless Under Bump Metallization Equipment inhouse

AEMtec implements Electroless Under Bump Metallization Equipment inhouse

Completion of extension building

Completion of extension building
Doubling of office and production space

AEMtec opens the Technology Center in Boston, USA

AEMtec opens the Technology Center in Boston, USA

Expansion of the wafer back-end capacity in the analysis and sawing unit

Expansion of the wafer back-end capacity in the analysis and sawing unit

capiton AG ist neuer Partner der AEMtec GmbH AEMtec Azubis werden Girls`Day Botschafterinnen Ersatzinvestition in AOI (Automatic Optical Inspection) (Kopie 1)

capiton AG is the new AEMtec GmbH partner
AEMtec apprentices become Girls’ Day ambassadors 
Replacement investment in AOI (Automatic Optical Inspection)
 

_ 2017

Investment in flying probe
AEMtec grows to 170 employees

Expansion of wafer back-end services to include UBM and solder balling

Expansion of wafer back-end services to include UBM and solder balling

Investment in an X-ray analysis system

Investment in an X-ray analysis system

Investment in a fully automatic wafer precision saw

Investment in a fully automatic wafer precision saw

Move to the new company building at the Berlin Adlershof Technology Park

Move to the new company building at the Berlin Adlershof Technology Park

Capacity expansion –investment in high accuracy die bonders

Capacity expansion –investment in high accuracy die bonders

Opening of the new clean room ISO 5 Investment in die bonders

Opening of the new clean room ISO 5
Investment in die bonders

Investment in gold wire bonders

Investment in gold wire bonders

Establishment of AEMtec as a spin-off of an international Technology Group

Establishment of AEMtec as a spin-off of an international Technology Group