AEMtec announces a major advancement in their wafer back-end manufacturing capabilities. AEMtec has implemented Electroless Under Bump Metallization (UBM) equipment into their facility!

This strategic step represents a significant milestone in their ongoing commitment to innovation and cutting-edge technologies.

The UBM process is an integral part of the wafer back-end services offered by AEMtec. Implementing this process in-house will result in improved lead times and greater production versatility. With this important initiative increased flexibility, maximized productivity and enhanced equipment accessibility are ensured.

Integrating the UBM process in-house will allow new engineering requests to be developed with more efficiency in our three-shift production schedule.

Qualification of the new UBM equipment will be complete in the third quarter of 2024.