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NEW APPROACH OF 3D CATHETER ASSEMBLY PROCESS

Demonstration of packaging development and assembly for an ultrasound catheter.

 

Our customer's challenging task to build prototypes with MEMs for an ultrasound catheter. 120 MEMS should be positioned on a cylindrical core. Positioning of the MEMS around the core required high accuracy. It was a big challenge to realize it. We found a new approach to do this.

 

HOW WE SOLVED IT

LISTEN TO INGOLF´S PRSENTATION ON 7th March on Imaps Advanced Packaging for Medical Microelectronics conference in Phoenix, Arizona at 11.45 AM.

https://imaps.org/page/Medical2025

Don’t miss this chance to hear powerful insights—join us.

AEMtec is one of the global acting specialists for the development and production of a variety of precision optoelectronic products. With a wide technology portfolio including Wafer Back-End Services, Chip on Board, Flip Chip, 3D Integration and Opto Packaging is AEMtec the right Partner for complex and reliable solutions in the sector of miniaturization. We offer the entire chain from packaging design to series productions. With recent acquisition of aspect systems we expanded our extended test services.