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Flexible solutions in SMT assembly

Surface mounted device (SMD) assembling machines place the SMDs into the previously applied soldering paste, then soldered using the reflow soldering process. They are thereby mechanically fixed and simultaneously contacted electrically.

SMT Processes

  • Screen printing
  • Adhesive dispensing gluing
  • SMD mounting
  • Reflow soldering
  • AOI
  • Circuit board wash
  • Mounting of special components
Ranges
SMD:
from 0,4 x 0,2mm (01005) to 75 x75mm or 50 x 150mm
SOIC/ QPF / QFN/ LCC:
Lead pitch 0.2 – 2.54mm
BGA/ LGA:
Ball pitch 0.25 – 3mm / Ball diameter 0.1 – 1mm
Wafflepack FC:
Dipping depth 50 – 500µm / Ball pitch, Ball diameter see BGA
PoP:
Dipping depth 50 – 500µm / Ball pitch, ball diameter see BGA
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LP Substrates

  • Rigid, rigid-flex
  • LCP/ ceramic/ polyimide/ epoxy glass fibre
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Solders

  • Leaded and lead-free solders of a wide range of alloys
  • Low-temperature solders