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Opto-encapsulation is mostly used when working with LEDs and photodiodes. With the aid of optically transparent or light-filtering encapsulation materials, chips and bonded wires are protected against mechanical damage and/or insulated from ambient influences and at the same time used constructively for light guidance purposes. An additional option is to protect optical components via partial encapsulation, leaving e.g. the active surface free.

AEMtec offers a variety of procedures for automated encapsulation via dispensing or jetting (in the nano- to milliliter range) using epoxies, silicones or acrylates. The encapsulation material can be single- or double-component as well as thermally or UV light-hardening.


AEMtec GmbH


+49 30 6392 7300