Following the successful extension of the wafer back-end portfolio by Under Bump Metallization (UBM) and Solder Balling, AEMtec enlarges now the wafer dicing segment. 

This investment in an…

If you are looking for expert help with wafer treatment, preparation and packaging, offering advice on product and process development as well as volume production - all from a one-stop-shop, then…

The sale of AEMtec GmbH is finalized now. The sale contract with capiton AG, Berlin, became effective by October 31, 2018. 

"AEMtec is pleased to find with capiton AG a dedicated cooperation partner…

exceet Gesellschaft AEMtec continues to expand its Berlin technology park

With the acquisition of the new FLS980Dxi Flying Probe Tester from Acculogic, AEMtec is now able to offer customers access to…