COMPLEX MICRO - AND OPTOELECTRONICS
As an established B2B company for complex and reliable solutions in the field of miniaturization, AEMtec offers a broad technology portfolio including wafer back-end services, chip on board, flip chip, 3D integration and opto packaging.
Customer-specific requirements from the medical, industrial and automation, data and telecommunications, semiconductor and aerospace sectors are reliably implemented soon.
The range of services includes design, development, industrialization, qualification, prototyping (NPI), test and test system development, series production, supply chain management and after sales services
System integration in electronics - challenges and strategies for future packaging technologies
Future technologies such as artificial intelligence, quantum technology or high-performance computing are the basis for solving challenges for society as a whole such as digitalization, the energy transition or environmental issues. At last, this is only possible through advanced or novel system integration strategies in microelectronics and microsystems technology.
Chiplet technology – Challenges and Opportunities
Optimized performance and integration of various technologies leads to greater efficiency in semiconductor solutions. Chiplet technology is a new design strategy in which, instead of a complex system-on-chip (SoC), several semiconductors (“chiplets”) are connected to each other using very short and dense wiring.
