A few weeks ago, we shared exciting news about the implementation of our new Electroless Under Bump Metallization (UBM) equipment. It`s time to inform about the next step.

Our new UBM line is now fully installed, and we are preparing for the first manufacturing processes, planned for November. We’re ready to take production to the next level!

AEMtec offers its customers Back-End production stages from wafer to complex micro and optoelectronic module assembly, from one source. For more details, check out our wafer back-end presentation on our website under Wafer Back-End Services.

Contact: sales@aemtec.com!