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SMT - Surface Mount Technology

Surface mounted device (SMD) assembling machines place the SMDs into the previously applied soldering paste, then soldered using the reflow soldering process. They are thereby mechanically fixed and simultaneously contacted electrically.

SMT Processes
  • Screen printing
  • Adhesive dispensing gluing
  • SMD mounting
  • Reflow soldering
  • AOI
  • Circuit board wash
  • Mounting of special components
Ranges
  • SMD: from 0,4 x 0,2mm (01005) to 75 x75mm or 50 x 150mm
  • SOIC/ QPF / QFN/ LCC: Lead pitch 0.2 – 2.54mm
  • BGA/ LGA: Ball pitch 0.25 – 3mm / Ball diameter 0.1 – 1mm
  • Wafflepack FC: Dipping depth 50 – 500µm / Ball pitch, Ball diameter see BGA
  • PoP: Dipping depth 50 – 500µm / Ball pitch, ball diameter see BGA
LP Substrates
  • Rigid, rigid-flex
  • LCP/ ceramic/ polyimide/ epoxy glass fibre
Solders
  • Leaded and lead-free solders of a wide range of alloys
  • Low-temperature solders

Contact

AEMtec GmbH

Engineering

+49 30 6392 7300
 engineering(at)aemtec.com