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Flip Chip

During the flip-chip process, the chip is placed directly onto the PCB-board, without additional connection wires and with the active surface facing down. Electrical connectivity with the circuit pattern is generated via bumps that are applied to the pads of the semiconductor. In addition to bonding using conventional procedures such as soldering and gluing, AEMtec also uses thermal compression and thermo-sonic bonding techniques. 

Flip-chip assembly permits especially compact dimensions and thus enables maximum circuit miniaturization. It also allows the shortest possible conductor lengths, which is particularly important for high-frequency applications.  

Using the flip-chip method, small components can be packed more densely and manufactured much more rapidly. An example would be the computer tomography detectors that AEMtec has developed in close collaboration with a medical industry client.

If the active surface of a component needs to be placed on the upward-facing side, but the connection should still be realized in the same way as in the FC process, AEMtec can develop the required solution by applying the Through Silicon Via (TSV) method. AEMtec has already been using TSV components successfully for years.

Flip-Chip Process

  • Fluxing
  • Flipping and mounting
  • Reflow soldering
  • Underfill

Flip-Chip Design Variants

  • Flip-chip soldering - up to 180 µm pitch
  • Isotropic conductive adhesive (ICA) - up to 800 µm pitch
  • Anisotropic conductive adhesive (ACA) - 120 µm pitch
  • Non-conductive adhesive (NCA) - 80 µm pitch
  • Ultrasonic - max. 100 stud balls
  • Thermal compression - max. number of bumps: dependent on size
  • Anisotropic Conductive Foil (ACF) - 50 µm pitch

Contact

AEMtec GmbH

Engineering

+49 30 6392 7300
 engineering(at)aemtec.com