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Technologies

At Home in all Chip Technologies

AEMtec offers a unique spectrum of high-end chip-level technologies. In our cleanroom facilities (ISO 5, ISO 7 and ISO 8) we apply a broad technological range of chip-on-board, flip chip, SMT, 3D integration and opto-packaging procedures. We work with all common substrates such as standard circuit boards (rigid, rigid-flex), films, ceramics, silicon wafer, glass or IMS.   

Multi-chip modules (MCMs) permit full-function realization as well as sub-layouts in the form of a system-in-package (SIP). In this way AEMtec supports modularization concepts and helps reduce manufacturing costs. For instance, AEMtec can accommodate highly integrated components with a large number of I/Os in modules with a very small footprint, without having to implement the entire board as a high-cost HDI circuit board.

AEMtec is certified according to ISO/TS 16949, ISO 9001, DIN/ISO 13485 and ISO 14001.

Contact

AEMtec GmbH

Engineering

+49 30 6392 7300
 engineering(at)aemtec.com