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Technologies - Opto-Packaging
Chip soldering (AuSn)
- Passive alignment of optical components
- Active fiber alignment - in preparation
- Mechanical assembly
- Electro-optical test
| Procedure | Eutectic soldering (AuSn) Passive alignment to 10 µm (4) Active optical alignment to 2 µm (4) Fiber alignment - in preparation Hermetic sealing - in preparation |
| Package | Metal Plastic Ceramic |
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