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Personnel |
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Technologies |
SMT
BGA / CSP
FC
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Process Development
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Production
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Test & Quality |
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Contact
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Technologies - Surface Mount Technology (SMT)
Screen printing
- Board assembly
- Reflow soldering (including lead-free)
- Washing
- Special components assembly
| Design styles | SMD down to 0201 QFP pitch down to 400 µm QFP, PLCC, BGA, 7x7 mm to 50x50 mm |
| Substrates | Circuit board rigid, rigid-flex Ceramics Flex |
| Solders | SnBi 139°C SnPbAg2 178°C SnAg3,5 221°C (lead-free) |
Deutsche Version
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News Ticker |
| A list with the latest news all about AEMtec is available here. |
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Current Jobs |
| Current Job Offerings. We are always interested to recruit qualified staff. Visit our Job Exchange. |
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AEMtec Newsletter |
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