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Technologies - Chip-on-Board (COB)

  • Die bonding

  • Wire bonding (Al & Au wedge bonding)

  • Wire bonding (Au ball bonding)

  • Ribbon bonding (Au & Al)

  • Pull & shear test

  • Chip encapsulation

 

Die bonding Wafers up to 8"
Waffle packs
Classified procedures
Traceability with data matrix or bar code
Programmable bond force
 
Wire bonding
Al wedge bonding 18 to 50 µm wire 80 µm pitch
Au wedge bonding 18 to 50 µm wire 80 µm pitch
Au ball bonding 18 to 50 µm wire 60 µm pitch
Au ribbon bonding Wire e.g. 50x12 µm  
 
Substrates Circuit board
Ceramics
Flex
Wafers
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