AEMtec GmbH

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SMT

BGA / CSP

COB

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Technologies

AEMtec provides a broad unrivaled range of packaging and connectivity techniques that are required to produce multi-chip modules in mixed technology. Our strength is the right combination of these techniques on all standard substrate types such as printed circuit boards (rigid, flex-rigid), sheeting, ceramics, glass and wafers.

Chip-on-board technology is our core business and a pivotal point in modern-day connectivity solutions. Bare dies are directly positioned on a substrate in a space-saving manner and a thermally optimized state so they are fit for high-frequency operation and feature unmatched reliability and cost efficiency. The main goal is to develop custom-engineered economical solutions in as little time as possible.

Multi-chip modules (MCMs) are able to handle complete functions and sub-layouts as a system in package (SIP). This allows AEMtec to support modularization concepts, while also contributing to reduced manufacturing costs. For example, AEMtec is able to accommodate highly integrated modular components with many I/Os on a limited area without any need to have the entire board manufactured as a HDI-board at high cost.

AEMtec performs:

SMT Surface Mount Technology The various components (Surface Mount Devices/=SMDs) are directly bonded onto the top of a board to be mechanically fixed and electronically contacted in subsequent soldering processes. Our special capabilities are: 0201, lead-free, special components Partial soldering
BGA/CSP Ball Grid Array / Chip Size Packaging Similar to hybrid MCMs, BGAs and CSPs make up "components of their own" which, in turn, can be mounted onto boards by applying SMT. Our special capabilities are: Underfill Dipping, fluxing
FC Flip Chip Flip Chip means that chips are bonded directly onto the substrate surface face down. The bumps are connected with the substrate by thermo compression bonding, soldering or gluing. Our special capabilities are: Solder FC bonding Adhesive FC bonding (ICA)
COB Chip-on-Board An unpackaged chip is fixed on the substrate. The benefits against classical circuit board technology are compact design, short paths, high reliability. Our special capabilities are: Al & Au, wedge, ball & ribbon bonding Stacked DIE
Opto-Packaging Assembly of Optical Components (e.g. laser & pin diodes) As with COB, optical components are directly fixed to a substrate in a bare, unpackaged state. This occurs with priority on high placement accuracy and careful handling of components. Our special capabilities are: Wafer mapping Opto-bonding & alignment

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