Product-examples:

Paroli 2 PCB, optical and electrical IC´s are mounted directly on the gold plated aluminium base plate Various and complex assembly steps in line with different solder and glue techniques Highest requirements to the accuracy of a +/-20 µm X-Y-Z placement of optical components Handling of very small and sensitive components, e.g. GaAIAs VCSEL-Array (3x0,4mm)
10 GHz OSA 10-layer PCBA with a special HF compatible material Highest complexity through high density interconnection Highest requirements for pick&place of CSP´s of 0,5mm pitch Au-Ribbon and Wire Bonding down to 35x25µm ribbons
1 GHz Tranceiver-Modul Processing of 0402 devices Mixed technologies (CoB & SMT) High volume production
Navigationssystem Processing of 0402 devices Mixed technologies (CoB & SMT) High volume production
MCM Au-Wire-Bonding Partial chip encapsulation Different BGA-sizes